XC7K325T-2FFG900C

The XC7K325T-2FFG900C Field Programmable Gate Array from Xilinx Inc. is a high-performance, low-power device designed for use in a wide range of applications. This FPGA is built on the Kintex-7 architecture and features 256-LBGA, 900-BBGA, and FCBGA packages. It is capable of operating in temperatures ranging from 0°C to 85°C and is available in a tray or surface mount configuration. The XC7K325T-2FFG900C is constructed with a Spartan-6 LX and CMOS technology, and is soldered with a Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) alloy. It has a 168-hour burn-in time and a 72-hour burn-in time for optimal performance. This FPGA is ideal for use in a variety of applications, including embedded systems, industrial automation, and communications.

Mounting Type	Surface Mount
Package/Case	256-LBGA 900-BBGA, FCBGA
Operating Temperature	0°C~85°C TJ
Packaging	Tray
Series	Spartan®-6 LX Kintex®-7
Moisture Sensitivity Level (MSL)	3 (168 Hours) 4 (72 Hours)
Terminal Finish	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Subcategory	Field Programmable Gate Arrays
Technology	CMOS